Paste & Powder
For surface and screen-printing application
Our pastes and powders are applied in thick film technology for printing of circuit boards and assembling of SMT-components.
Depending on the application, different materials with different grain sizes are available.
|Tin||good wetting behaviour|
|Silver / Tin||high melting point|
high corrosion resistance
high thermal conductivity
high tensile strength
|Silver / Copper / Tin||high strength|